Title:
バニシ仕上げのプロセス制御のための方法及び装置
Document Type and Number:
Japanese Patent JP5288689
Kind Code:
B2
Abstract:
An apparatus for process control of a burnishing process including a body having a first end (14) and a second end (16), at least one process control coupon (100), and structure for attaching the process control coupon (100) to the body. At least one edge (101, 102, 103, 104) of the process control coupon (100) is clamped along the entire length thereof during burnishing. A method of process control for burnishing of components comprising selecting at least one process control coupon (100), selecting an apparatus (10) for holding the process control coupon(s) (100), attaching the process control coupon(s) (100) to the apparatus (10), selecting a region (301) on the surface (121, 122) of the process control coupon(s) (100) for burnishing, burnishing a patch (303) on the selected region (301) using a burnishing process, and, measuring at least one physical parameter at a selected location of the process control coupon(s) (100) after burnishing.
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Inventors:
Dale Robert Lombard
Albert Luna
Michael jay brunck
Albert Luna
Michael jay brunck
Application Number:
JP2006133778A
Publication Date:
September 11, 2013
Filing Date:
May 12, 2006
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
B24B39/06; C21D7/08
Domestic Patent References:
| JP2000094346A | ||||
| JP2001150336A | ||||
| JP41001919A |
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Hirokazu Ogura
Toshihisa Kurokawa
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