Title:
Methods for manufacturing resin compositions, cured films, laminated films, and semiconductor devices
Document Type and Number:
Japanese Patent JP6303503
Kind Code:
B2
Abstract:
[Problem] To provide a highly heat resistant resin composition which exhibits good tackiness at low temperatures less than or equal to 180°C, and whose production of a volatile portion due to decomposition or the like is small even at high temperatures greater than or equal to 250°C, and whose increase in adhesive force is small even after passage through a heat treatment step, and therefore which allows a base material to be easily peeled off at room temperature when the base material is to be peeled off, and a cured membrane and a laminate film that employ this resin composition. [Solution Means] A resin composition containing a polyimide-based resin and a methylol-based compound, the resin composition being characterized in that the polyimide-based resin has an acid dianhydride residue and a diamine residue, and has as the diamine residue at least a residue of a polysiloxane-based diamine represented by General formula (1) and a residue of an aromatic diamine having a hydroxyl group, and a cured product and a laminate film that employ this resin composition.
(n is a natural number, and an average value thereof calculated from an average molecular weight of the polysiloxane-based diamine is in a range of 5 to 30. R 1 and R 2 may be individually the same or different, indicating an alkylene group or a phenylene group whose carbon number is 1 to 30. R 3 to R 6 may be individually the same or different, indicating an alkyl group, a phenyl group or a phenoxy group whose carbon number is 1 to 30.)
Inventors:
Takuo Watanabe
Lee Zhongshan
Lee Zhongshan
Application Number:
JP2013555106A
Publication Date:
April 04, 2018
Filing Date:
September 25, 2013
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
B32B27/34; C08G73/10; C08K5/16; C08L79/08; C09J7/10; C09J11/06; C09J179/08; H01B17/60
Domestic Patent References:
| JP10265571A | ||||
| JP2011123278A | ||||
| JP2007314647A | ||||
| JP2006133757A | ||||
| JP2005043883A |
Foreign References:
| WO2009078365A1 |