Title:
半導体デバイスを処理するための方法、システムおよびコンピュータ・プログラム製品ならびにボンディングされた半導体パッケージ
Document Type and Number:
Japanese Patent JP6788675
Kind Code:
B2
Abstract:
Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
Inventors:
Knickerbocker, John
Gerome, Jeffrey, Donald
Hong, Lee Wen
Andrew, Paul
Dan, Bin
Yang, Cornelia, Tsang
Gerome, Jeffrey, Donald
Hong, Lee Wen
Andrew, Paul
Dan, Bin
Yang, Cornelia, Tsang
Application Number:
JP2018532404A
Publication Date:
November 25, 2020
Filing Date:
December 02, 2016
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
International Classes:
H01L21/56; C09D5/32; C09D7/41; C09D201/00; H01L23/12
Domestic Patent References:
| JP2001189460A | ||||
| JP2007242888A |
Foreign References:
| US20140144593 | ||||
| US20140106473 |
Attorney, Agent or Firm:
Takeshi Ueno
Tasaichi Tanae
Tasaichi Tanae