Title:
MICRO DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2007326188
Kind Code:
A
Abstract:
To enable forming of protective film having high adhesion and forming high accurate pattern by suppressing occurrence of a specific liquid flow mark in a spin etching machining when a spin etching method is used in a step for thin machining a front substrate.
In a micro device manufacturing method, the spin etching method is used in a step for thin-machining the substrate. The spin etching step is divided into a plurality of times and the each rotating direction is alternately reversed or the spin etching step is divided into a plurality of stages and the each rotating speed is varied.
COPYRIGHT: (C)2008,JPO&INPIT
Inventors:
KANRI RYOJI
Application Number:
JP2006159830A
Publication Date:
December 20, 2007
Filing Date:
June 08, 2006
Export Citation:
Assignee:
CANON KK
International Classes:
B81C1/00; B41J2/16; H01L21/306
Attorney, Agent or Firm:
Keizo Nishiyama
Yuichi Uchio
Yuichi Uchio
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