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Patent Searching and Data


Title:
MICRO RELAY
Document Type and Number:
Japanese Patent JP2001068006
Kind Code:
A
Abstract:

To provide a relay, securing initial gap required for insulation and enhanced in contact pressure without increasing the drive voltage by composing a movable board with a first moving piece cut out by forming a slit and a second moving piece formed in a first moving piece and less elastically deformable than the first movable piece and forming a moving contact on the lower surface of a second movable piece.

When electrostatic attraction is generated by applying a voltage between a fixed board 10 and a movable electrode 23, the movable electrode 23 which is easier to elastically deform than a second moving piece 27 is attracted to the fixed board 10 side and bent. Thereby, even after a moving contact 28 is lowered and abuts on fixed contacts 14b, 17b, the distance between the fixed board 10 and the movable electrode 23 is reduced, so that larger electrostatic attraction is generated between them. The movable electrode 23 further approaches the fixed board 10 and is attracted by the fixed board 10. As a result, the second moving piece 27 is bent to provide large contact pressure, and a signal is transmitted stably between signal wires 14a, 17a. Preferably, the movable electrode (first moving piece) is formed into a counterswastika- shaped form.


Inventors:
NAKAJIMA TAKUYA
FURUMURA YOSHIYUKI
SEKI TOMONORI
SAKATA MINORU
Application Number:
JP24135199A
Publication Date:
March 16, 2001
Filing Date:
August 27, 1999
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
H01H59/00; (IPC1-7): H01H59/00
Attorney, Agent or Firm:
Kaoru Aoyama (3 people outside)