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Title:
MICRO-RELAY
Document Type and Number:
Japanese Patent JPH06338244
Kind Code:
A
Abstract:

PURPOSE: To provide a micro-relay with which a large contact load can be obtained, and which has high electric reliability.

CONSTITUTION: A micro-relay 50 has a movable part base body 20 and a fixed part base body 40. The fixed part base body 40 has a substrate 21, and fixed contact layers 23a, 23b formed on its surface. The movable part base body 20 and the fixed part base body 40 are fixed to each other at both ends. The movable part base body 20 has a bimetal 1, a movable contact layer 3, and a heater circuit 5. The bimetal 1 is formed in a lamination structure of a first metal film 1a and a second metal film 1b. The first metal film la comprises material having a smaller thermal expansion coefficient than the second metal film 1b. A movable contact layer 3 is formed at an inverse middle position of length of the movable base body 20.


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Inventors:
YAMASHITA ZENJIRO
INUI TETSUYA
HIRATA SUSUMU
ISHII YORISHIGE
OTA KENJI
MATOBA KOJI
Application Number:
JP12749093A
Publication Date:
December 06, 1994
Filing Date:
May 28, 1993
Export Citation:
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Assignee:
SHARP KK
International Classes:
H01H61/00; H01H1/00; H01H61/02; (IPC1-7): H01H61/02; H01H61/00
Attorney, Agent or Firm:
Fukami Hisaro



 
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