Title:
ミクロ粗面化した電着銅箔及び銅張積層板
Document Type and Number:
Japanese Patent JP7270579
Kind Code:
B2
Abstract:
Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-roughened electrodeposited copper foil has an Rlr value of 1.05 to 1.60, or an Sdr of 0.01 to 0.08. With the surface characteristics, the electron path distance can be shortened, such that the micro-roughened electrodeposited copper foil can reduce the insertion loss of the copper clad laminate at high frequencies and have the desired peel strength.
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Inventors:
Song Yun
Lee Shiken
Xu Hong Wei
Yu Takashi
Lee Shiken
Xu Hong Wei
Yu Takashi
Application Number:
JP2020101588A
Publication Date:
May 10, 2023
Filing Date:
June 11, 2020
Export Citation:
Assignee:
Kinai Kaitan Co., Ltd.
International Classes:
C25D7/06; B32B15/18; C25D1/04; C25D5/10; C25D5/16; H05K1/09
Attorney, Agent or Firm:
Sakuo Yamaguchi
Nobuyuki Oshima
Shinjiro Yamaguchi
Tadahiro Matsumoto
Nobuyuki Oshima
Shinjiro Yamaguchi
Tadahiro Matsumoto
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