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Title:
MICRO THERMAL EXPANSION TEMPERATURE SENSOR USING THERMAL EXPANSION MATERIAL
Document Type and Number:
Japanese Patent JP2003344171
Kind Code:
A
Abstract:

To provide a micro thermal expansion temperature sensor using a thermal expansion material as a material for constituting a sensitive thermal expansion temperature sensor and having a large temperature coefficient of resistance.

The micro thermal expansion temperature sensor is provided with a thermal expansion temperature sensor layer disposed on a tip of a support base and comprising a material having a large thermal expansion coefficient, and measures a temperature of a minute region. In the micro thermal expansion temperature sensor, a thermal conduction control layer is provided between the support base and the thermal expansion temperature sensor layer, and the thermal expansion material covered with a high thermal conduction insulation layer on a sample contact side of the thermal expansion temperature sensor layer, is used.


Inventors:
Nishikawa, Yuji
Application Number:
JP2002000154917
Publication Date:
December 03, 2003
Filing Date:
May 29, 2002
Export Citation:
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Assignee:
KONICA MINOLTA HOLDINGS INC
International Classes:
G01K5/50; G01K5/00; (IPC1-7): G01K5/50