To provide a micro through-hole forming device capable of easily forming many micro through-holes on a sheet of synthetic resin in a simple manner and in a short time.
The micro through-hole forming device 10 includes, a supporting base 11, a back sheet 12 for supporting a base sheet 20, and an ultrasonic form block 30 containing many projections 31 at a lower part. The ultrasonic form block 30 is movable vertically, and the projection 31 ultrasonic-vibrates. Many protrusions 18 are provided at positions corresponding to the projections 31 of the ultrasonic form block 30 on the surface of the supporting base 11. Under a condition that the base sheet 20 and the back sheet 12 are pinched between the projection 31 and the protrusion 18, the projection 31 is made to ultrasonic-vibrate so that the base sheet 20 is heated by vibration. The base sheet 20 is penetrated with the projection 31 so that many micro though-holes 41 are formed on the base sheet 20.
FUJITA HIROSHI
NAGANUMA HIROYUKI
SEKI MASASHI
YANAGA TAKESHI
TAGUCHI TETSUYA
| JP2010137313A | 2010-06-24 | |||
| JPS62130895U | 1987-08-18 | |||
| JPS5989636U | 1984-06-18 | |||
| JPH04246514A | 1992-09-02 | |||
| JP2008168222A | 2008-07-24 | |||
| JP2010137313A | 2010-06-24 | |||
| JP2008168222A | 2008-07-24 |
Hiroyuki Nagai
Katsuomi Isogai
Yukihiro Hotta
Takuhisa Murata