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Patent Searching and Data


Title:
MICROCAPSULE AND AQUEOUS COMPOSITION CONTAINING IT
Document Type and Number:
Japanese Patent JP2006028254
Kind Code:
A
Abstract:

To provide an aqueous dispersion containing microcapsules suitable to produce a one-pack type epoxy compound product.

The aqueous dispersion-like composition contains microcapsules, whose core material is a compound having a reactive epoxy group and whose wall material is at least a polyurethane or a polyurea, as a disperser. The microcapsule keeps a stable dispersion state even in coexistence with a component having a nucleophilic functional group. The dispersion hardens on heating. The compound having a reactive epoxy group is a water-insoluble compound having ≥2 glycidyl groups in the molecule. The polyurethane or the polyurea comprises at least a reaction product of a compound having ≥2 isocyanate groups and a polyamine or a polyol.


Inventors:
ARAYA KENICHI
OKUDA TOSHIYUKI
Application Number:
JP2004206071A
Publication Date:
February 02, 2006
Filing Date:
July 13, 2004
Export Citation:
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Assignee:
CHUKYO YUSHI KK
International Classes:
C08L63/00; C09J163/00