Title:
マイクロカプセル
Document Type and Number:
Japanese Patent JP2007503293
Kind Code:
A
Abstract:
The present invention relates to microcapsules, and more particularly to microcapsules where an aqueous bead or beads comprising the active ingredient is encapsulated in or by a hydrophobic shell matrix. The present invention relates also to novel methods for preparing the microcapsules according to the invention, as well as to the use of the microcapsules of the present invention. A microcapsule of the present invention comprises a solidified hydrophobic shell matrix, an encapsulated aqueous bead or beads which is/are encapsulated in or by the solidified hydrophobic shell matrix, and an active ingredient or active ingredients dissolved or incorporated in the encapsulated aqueous bead or beads.
Inventors:
Coin, bob
John Frager
Gowin, Sebastian
Hansen, Kirstenbjorn
Ingram, Richard
Isaac, Toben
Thomas, Linda Valery
Tse, Kasrun, Luise
John Frager
Gowin, Sebastian
Hansen, Kirstenbjorn
Ingram, Richard
Isaac, Toben
Thomas, Linda Valery
Tse, Kasrun, Luise
Application Number:
JP2006523668A
Publication Date:
February 22, 2007
Filing Date:
August 06, 2004
Export Citation:
Assignee:
Danisco A/S
International Classes:
B01J13/06; A21D2/00; A23B4/10; A23B4/12; A23B4/20; A23B4/22; A23B5/06; A23B5/14; A23B5/16; A23C19/084; A23C19/11; A23L1/00; A23L1/30; A23L2/52; A23L3/3463; A23L3/3472; A23L3/3544; A23L3/3571; A23L13/70; A61K9/50; B01J13/04; B01J13/08
Domestic Patent References:
| JP2000026283A | 2000-01-25 | |||
| JPH0549433A | 1993-03-02 | |||
| JP2001097819A | 2001-04-10 |
Foreign References:
| US5204029A | 1993-04-20 |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita