Title:
マイクロチップならびに試料抽出方法、試料分離方法、試料分析方法、および試料回収方法
Document Type and Number:
Japanese Patent JP4356694
Kind Code:
B2
Abstract:
A sample-carrier complex ( 119 ) is introduced into a sample introducing portion ( 107 ), and the sample-carrier complex ( 119 ) is moved and deposited on a damming portion ( 111 ). The damming portion ( 111 ) is heated at a stage in which the predetermined amount of sample-carrier complex ( 119 ) is deposited on the damming portion ( 111 ). A temperature is increased to a predetermined temperature to break down the sample-carrier complex ( 119 ) into a sample ( 121 ) and a carrier ( 123 ). A voltage is applied between the sample introducing portion ( 107 ) and a sample recovery portion ( 109 ) to cause the sample ( 121 ) to pass through a gap between columnar bodies ( 115 ) and move into a second channel ( 106 ) to perform predetermined separation and analysis or recovery operation.
More Like This:
Inventors:
Toru Sano
Masakazu Baba
Kazuhiro Iida
Hisao Kawaura
Noriyuki Iguchi
Wataru Hattori
Hiroko Someya
Masakazu Baba
Kazuhiro Iida
Hisao Kawaura
Noriyuki Iguchi
Wataru Hattori
Hiroko Someya
Application Number:
JP2005503761A
Publication Date:
November 04, 2009
Filing Date:
March 19, 2004
Export Citation:
Assignee:
NEC
International Classes:
G01N35/08; B01D57/02; B01L3/00; G01N1/10; G01N1/40; G01N27/447; G01N37/00
Domestic Patent References:
| JP2002502597A | ||||
| JP6222060A | ||||
| JP53130424A | ||||
| JP2004042012A |
Foreign References:
| WO2001069230A2 |
Attorney, Agent or Firm:
Shinji Hayami
Previous Patent: メッセージ配信装置及びその方法並びにシステム及びプログラム
Next Patent: HEAT EXCHANGER FOR SEMICONDUCTOR TREATMENT FLUID
Next Patent: HEAT EXCHANGER FOR SEMICONDUCTOR TREATMENT FLUID