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Title:
MICROELECTRONIC CONTACT STRUCTURE, AND METHOD OF MAKING SAME
Document Type and Number:
Japanese Patent JP2008014957
Kind Code:
A
Abstract:

To provide a microelectronic contact structure and a method of making the same.

A device includes an electronic component including a trench in a surface, a terminal disposed on the surface of the electronic component and spaced from the trench, and an elongate spring contact element. The elongate spring contact element has a base portion affixed to the terminal, a body portion spaced above the surface of the electronic component and extended across the trench, and a contact portion spaced above the trench. The contact portion is movable toward the trench, and the spring contact element has a first spring constant. When the contact portion is moved enough toward the trench, the body portion contacts the end located between the surface and the trench, and when the contact portion is moved further toward the trench, the spring contact element exhibits a second spring constant different from the first spring constant.


Inventors:
KHANDROS IGOR Y
ELDRIDGE BENJAMIN N
MATHIEU GAETAN L
GARY W GRUBE
Application Number:
JP2007244528A
Publication Date:
January 24, 2008
Filing Date:
September 20, 2007
Export Citation:
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Assignee:
FORMFACTOR INC
International Classes:
G01R1/067; G01R1/073; G01R3/00; G01R31/28; G01R31/316; H01L21/66; H01L23/48; H01L23/485; H01L23/498; H01R13/24; H01H1/00; H05K3/20; H05K3/34
Domestic Patent References:
JPH06308164A1994-11-04
JPH05251523A1993-09-28
JPH06213929A1994-08-05
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita