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Title:
MICROETCHING AGENT FOR COPPER AND COPPER ALLOY
Document Type and Number:
Japanese Patent JP3458023
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To etch the surface of copper to form deep recesses so that the surface has excellent adhesion property to a solder resist and the like by incorporating a minute amt. of a polymer compd. having polyamine chains and cation groups into a microetching agent for copper.
SOLUTION: A polymer compd. having polyamine chains and cation groups is added by 0.00001-1.0wt.% to a microetching agent for copper and copper alloys comprising a soln. containing an oxidizing agent for copper. As for the polymer compd. a polyethylene imine and a polyalkylene polyamine are preferable. Since deep recesses are formed on the surface of copper or copper alloys treated with this microetching agent, the surface has good adhesion property to a resin such as prepreg, solder resist and dry film resist. Moreover, the surface of copper treated has excellent soldering property.


Inventors:
Yoshiro Maki
Toshiko Nakagawa
Yasushi Yamada
Takashi Haruta
Maki Arimura
Application Number:
JP19663695A
Publication Date:
October 20, 2003
Filing Date:
August 01, 1995
Export Citation:
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Assignee:
MEC Co., Ltd.
International Classes:
C23F1/18; H01L21/308; H05K3/38; H05K3/06; H05K3/28; H05K3/46; (IPC1-7): C23F1/18; H01L21/308
Domestic Patent References:
JP657453A
JP657452A
JP7292483A
JP609882A
JP5144532A
Other References:
【文献】特許2923524(JP,B2)
【文献】米国特許4956035(US,A)
Attorney, Agent or Firm:
Tadashi Hagino (3 outside)