Title:
微細加工構成素子及びその製造方法
Document Type and Number:
Japanese Patent JP4886147
Kind Code:
B2
Abstract:
A method of manufacturing a micromechanical component has a substrate ( 1 ), a movable sensor structure ( 6 ) in a micromechanical functional layer ( 5 ) located over the substrate; a first sealing layer ( 8 ) on the first micromechanical functional layer ( 5 ) which is at least partly structured; a second micromechanical functional layer ( 10 ) on the first sealing layer ( 8 ), which has at least one sealing function and is anchored at least partly in the first micromechanical functional layer ( 5 ); and a second sealing layer ( 8 ) on the second micromechanical functional layer ( 10 ). The sensor structure ( 6 ) is provided with trenches ( 7 ) whose width is not larger than a maximum trench width ( 66 ), which is sealable by the first sealing layer ( 8 ) in the form of plugs ( 9 ) which do not extend to the trench bottoms.
Inventors:
Marx Lutz
Application Number:
JP2001584169A
Publication Date:
February 29, 2012
Filing Date:
March 21, 2001
Export Citation:
Assignee:
ROBERT BOSCH GMBH
International Classes:
B81C1/00; B81B3/00; B81B7/00; G01P1/02; G01P15/08; G01P15/125
Domestic Patent References:
| JP7015019A | ||||
| JP7241088A | ||||
| JP2000124465A | ||||
| JP8264810A | ||||
| JP9503344A | ||||
| JP8506857A |
Foreign References:
| WO1998029748A1 |
Attorney, Agent or Firm:
Toshio Yano
Einzel Felix-Reinhard
Einzel Felix-Reinhard