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Title:
マイクロマシン装置及びマイクロマシン装置の製造方法
Document Type and Number:
Japanese Patent JP5193639
Kind Code:
B2
Abstract:
An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such a manner that the beam-like part moves closer to or apart from the signal line, and changes the electric characteristics concomitantly with the deformation, a deformation restraint section constituted of a material having a higher viscosity coefficient than the conductive material, provided on the opposite side of the micromachine to the signal line, for restraining deformation of the micromachine in a direction in which the micromachine is separated from the signal line, and a sealing body provided on the principal surface of the substrate, for covering the micromachine with a hollow section located therebetween.

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Inventors:
Susumu Obata
Michinobu Inoue
Takeshi Miyagi
Application Number:
JP2008071571A
Publication Date:
May 08, 2013
Filing Date:
March 19, 2008
Export Citation:
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Assignee:
Toshiba Corporation
International Classes:
B81B3/00; B81C1/00; H01G5/16; H01H49/00; H01H59/00
Domestic Patent References:
JP2006147995A
JP2003503816A
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Ryo Hashimoto
Tetsuya Kazama
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen



 
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