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Title:
MICROMACHINING SENSOR MODULE MOUNTING STRUCTURE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3791262
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide micromachining sensor module mounting structure capable of further miniaturize a micromachining sensor module and its manufacturing method.
SOLUTION: In this micromachining sensor module mounting structure comprising a microvalve 1 to control the flow rate of fluid and a pressure sensor 2 to detect the pressure of fluid mounted on a pedestal 3 in which a fluid passage 4 is formed, a first flow passage 4a is provided in a specified direction in the pedestal 3, and a second flow passage 4b is provided in a direction different from that of the first flow passage 4a to form an integral flow passage 4 with both flow passages 4a and 4b intersect each other. At least three holes for the flow passages are formed in the surface of the pedestal 3. The microvalve 1 is mounted on the first hole, the pressure sensor 2 is mounted on the second hole, and the third hole is used as a hole for introducing fluid.


Inventors:
Kazunori Kuzuhara
Shigenari Takami
Takashi Saijo
Hiroshi Saito
Sumio Akai
Application Number:
JP30474099A
Publication Date:
June 28, 2006
Filing Date:
October 26, 1999
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
B81B7/02; F15C5/00; B81B3/00; F15C3/04; F16K27/00; F16K31/70; (IPC1-7): F15C5/00; B81B7/02; F15C3/04; //F16K27/00; F16K31/70
Domestic Patent References:
JP3129101A
JP4064701A
JP11010887A
JP63163002A
JP60152803U
JP7145874A
JP10184616A
JP10190190A
JP10142532A
JP9505130A
Attorney, Agent or Firm:
Junji Ando