Title:
MICROMECHANICAL DEVICE
Document Type and Number:
Japanese Patent JP2001203371
Kind Code:
A
Abstract:
To provide generation of internal stress during fabrication process of a sensor.
This invention provides a pedestal structure and a manufacturing method of its stress release assembly with minormechanical sensors, in particular acceleration sensor. angular velocity sensors, inclination sensors or angular acceleration. At least one silicon seismic mass is used as sensing element. The at least one silicon seismic mass is jointed to the silicon frame via the assembly pedestal, the surface of which is bonded to a covering wafer, either glass or silicon.
Inventors:
LAPADATU DANIEL
KVISTEROY TERJE
JAKOBSEN HENRIK
KVISTEROY TERJE
JAKOBSEN HENRIK
Application Number:
JP2000329044A
Publication Date:
July 27, 2001
Filing Date:
October 27, 2000
Export Citation:
Assignee:
SENSONOR ASA
International Classes:
B81B3/00; B81B7/00; G01C19/56; G01P1/00; G01P3/00; G01P15/08; G01P15/12; G01P15/125; H01L21/306; H01L29/84; (IPC1-7): H01L29/84; G01P9/04; G01P15/12; G01P15/125; H01L21/306
Attorney, Agent or Firm:
Yasuo Ishikawa (1 outside)
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