MICROMECHANICAL SENSOR, AND MANUFACTURING METHOD THEREFOR

Title:

MICROMECHANICAL SENSOR, AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

Japanese Patent JP2005315890

Kind Code:

A

Abstract:

To expand and improve a function, reliability and convenience, starting from a micromechanical sensor for detecting at least the first pressure of the first medium having at least one substrate 100 comprising a semiconductor material, and having at least two sensor elements 110, 120 in the substrate, without increasing a cost.

The first sensor element 120 detects an absolute pressure quantity of the first medium, and the second sensor element 110 detects a relative pressure quantity of the first medium.

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Inventors:

VOSSENBERG HEINZ-GEORG

Application Number:

JP2005130159A

Publication Date:

November 10, 2005

Filing Date:

April 27, 2005

Export Citation:

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Assignee:

BOSCH GMBH ROBERT

International Classes:

G01L9/00; G01L13/02; G01L13/06; H01L29/84; (IPC1-7): G01L9/00; G01L13/06; H01L29/84

Domestic Patent References:

JPS55106331A	1980-08-15
JP2000009575A	2000-01-14
JPH0666658A	1994-03-11

Attorney, Agent or Firm:

Toshio Yano
Einzel Felix-Reinhard
Reinhard Einsel

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