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Title:
MICROOPROJECTION TYPE MASK ALIGNMENT DEVICE
Document Type and Number:
Japanese Patent JPS5541739
Kind Code:
A
Abstract:
PURPOSE:To provide a micro-projection type mask alignment device by which checked patterns formed in the surface of a semiconductor wafer can be located in the least divergence by controlling X-, Y-, theta-table systems in accordance with light projected to the patterns through a mask and light reflected from the wafer. CONSTITUTION:A semiconductor wafer 3 having checked patterns is placed on a table 28 comprising an X-table 28a, Y-table 28b and a rotary theta-table 28c, over which is placed a freely rotating mask 1 having alignment marks 6 with a micro- projection lens 2 provided inbetween. The amsk 1 is exposed to light by way of an optical fiber 48a having a condenser lens 47a and a mirror 46a from one side and at the same time, another optical fiber 48b from the other side. Thereupon, the light passed through the mask 1 and reflected from the wafer 3 is subjected to detection, using light-receptive elements 24 and 25 of detectors 45a and 45b, respectively, so that the table 28 can be moved in accordance with deviations against an optical axis 34 of a projection lens 4 provided above the mask 1.

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Inventors:
KOIZUMI MITSUYOSHI
AKIYAMA NOBUYUKI
OOSHIMA YOSHIMASA
Application Number:
JP11464278A
Publication Date:
March 24, 1980
Filing Date:
September 20, 1978
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01L21/30; G01B11/00; G03F7/20; G03F9/00; H01L21/027; H01L21/67; H01L21/68; (IPC1-7): G03B27/58; G03F9/00; H01L21/30
Domestic Patent References:
JPS52109875A1977-09-14
JPS5352072A1978-05-12



 
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