To provide a microparticle filling type microchip having a high degree of design and excellent productivity.

In this microchip formed by laminating a pair of flat plates, a substrate 11 where a recessed particle filling chamber 16 for filling therein particles 15 for adsorbing an object component and two groove-shaped liquid-sending passages 13 for introducing/discharging liquid into/from the particle filling chamber 16 are formed separately, and a surface plate 12 equipped with recessed connection flow passages 18 formed respectively on the position approximately corresponding to each boundary part between the particle filling chamber 16 and the liquid-sending passages 13 are bonded so that the liquid-sending passages 13, the particle filling chamber 16, and the connection flow passages 18 are positioned inside, to thereby connect the liquid-sending passages 13 to the particle filling chamber 16 by the connection passages 18.