To overcome such a problem that various limitations are imposed on product design or component purchase since a connector and a gasket are assembled when integrating a microphone into equipment and it is necessary for an assembly marker to collect such three components and to assemble them.
The microphone is configured by bonding a connector 2 and a gasket 4 on the lower surface and upper surface of a microphone body 1. The microphone has a three-layer structure composed of planar components and in a production process, assemblies integrated by locating a large number of components in the shape of lattice, namely, an assembly of the microphone body, an assembly of a connector and an assembly of a gasket are prepared. Then, such assemblies are bonded while being piled up as they are and a laminate assembly is provided in which a large number of products is arranged longitudinally and laterally and integrated. By dicing such an assembly along the borderline of individual product areas, each divided piece forms microphones and a large quantity of products can be simultaneously provided.
KOJIMA TSUTOMU
CITIZEN IWATE CO LTD
JP2000197192A | 2000-07-14 | |||
JP2000299146A | 2000-10-24 | |||
JP2001045597A | 2001-02-16 | |||
JP2003503991A | 2003-01-28 | |||
JPH1141682A | 1999-02-12 | |||
JPH1155795A | 1999-02-26 |
WO2001003468A2 | 2001-01-11 |
Next Patent: MICROSPEAKER AND BACK SOUND PROCESSING METHOD THEREFOR