Title:
MICRORELAY AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH06267383
Kind Code:
A
Abstract:
PURPOSE: To provide a small relay which can be integrated by using a bimetal formed by photolithography.
CONSTITUTION: A bimetal 102 (formed by lamination of films 102a, 102b of two different kinds of metals) formed by photolithography; a heater circuit 104a (heater circuit terminals: 104b and 104c) for heating the bimetal 102 formed by photolithography; and electrodes (105: lower electrode, 106: upper electrode) formed by photolithography and driven by the bimetal 102 are laminated on one substrate 101.
Inventors:
INUI TETSUYA
HIRATA SUSUMU
ISHII YORISHIGE
YAMASHITA ZENJIRO
OTA KENJI
HIRATA SUSUMU
ISHII YORISHIGE
YAMASHITA ZENJIRO
OTA KENJI
Application Number:
JP5582993A
Publication Date:
September 22, 1994
Filing Date:
March 16, 1993
Export Citation:
Assignee:
SHARP KK
International Classes:
H01H11/00; B81B3/00; B81C1/00; H01H37/52; H01H61/02; (IPC1-7): H01H37/52; H01H11/00
Attorney, Agent or Firm:
Fukami Hisaro