To provide a microstructure processing method and apparatus, and a microstructure, wherein the pattern of the microstructure formed on a wafer can be dried without causing it to collapse.

In the microstructure processing method, a microstructure is processed by the processing method, having a process wherein the microstructure portion of the surface of the microstructure processed by a wet processing apparatus 2 is covered with a protective film made of a solid substance of a substituted medium, whose melting point is not lower than 31C, in an environment having a pressure not lower than the critical pressure of super-critical carbon dioxide, and having a process for solving and removing the solid substance of the protective film of the surface of the microstructure by the supercritical carbon dioxide and then drying the microstructure.