PURPOSE: To form an inductor and a microstrip line as an integrated circuit without deteriorating the characteristic of them by making a thickness of a part of a substrate forming a meandering line thinner than the thickness of a part of the substrate forming the inductor.

CONSTITUTION: An inductor 2 and a meandering microstrip line (guide line) 3 connecting to the inductor 2 are provided to the upper face of an insulation substrate. On the other hand, a rear ground electrode (ground electrode face) 7 is provided to a lower face of the insulation substrate 1. Then the substrate 1 has a part whose thickness is comparatively thick and a part whose thickness is comparatively thin, and the insulating substrate 1 is an alumina group ceramic substrate, the microstrip line 3 is formed to the upper face of the part whose thickness is comparatively thin of the insulation substrate 1 and the inductor 2 is formed to the upper face of part whose thickness is comparatively thick of the insulation substrate 1. Thus, the inductor 2 and the microstrip line 3 are integrated on a same substrate, while their characteristics are not deteriorated.