Title:
電子レンジ加熱用容器及びその製造方法
Document Type and Number:
Japanese Patent JP7218504
Kind Code:
B2
Abstract:
To provide a container for microwave heating which prevents damages such as formation of a hole from happening even if hygroscopic resin is used in an interlayer.SOLUTION: A container for microwave heating with at least inner and outer layers and an interlayer is characterized as such that the interlayer is made of hygroscopic resin and at least one interface of the interlayer is in a non-adhesive state with the adjacent layer.SELECTED DRAWING: Figure 1
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Inventors:
Fumie Matsunaga
Yusuke Ito
Yusuke Ito
Application Number:
JP2018074892A
Publication Date:
February 07, 2023
Filing Date:
April 09, 2018
Export Citation:
Assignee:
Toyo Seikan Co., Ltd.
International Classes:
B65D1/28; B26D7/10; B26F1/44; B29C51/14; B32B1/02; B32B1/04; B32B27/06; B65D1/00; B65D65/40; B65D81/34
Domestic Patent References:
| JP10180952A | ||||
| JP2014101132A | ||||
| JP2005306426A |
Attorney, Agent or Firm:
Atago Patent Attorneys Office