PURPOSE: To improve the high frequency characteristic and the operability of manufacture by forming a throughhole penetrating through both front and rear sides of an insulation board so as to form a ground resistor.

CONSTITUTION: While a circuit pattern such as a microwave amplifier circuit is formed on the front side of an insulation board 22, a ground electrode is provided on a rear side. Then a throughhole 30 penetrating from the front side to the rear side is pierced into the insulation board 22, a resistor is formed in the throughhole 30 and the circuit pattern is connected to the ground electrode on the rear side via the resistor. Since the resistor is formed in the throughhole 30 in such a manner, the length of a path from the resistor to the ground electrode on the rear side is decreased. Thus, the parasitic inductance proportional to the length of the path from the resistor to the ground electrode is reduced to improve the high frequency characteristic. Moreover, the chip resistor is omitted from the insulation board and the high density packaging is contrived by the omission and the job process to load the chip resistor is reduced, thereby improving the job performance and the reliability.