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Title:
MICROWAVE INTEGRATED CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPS62136106
Kind Code:
A
Abstract:

PURPOSE: To improve the grounding characteristic of a substrate and to prevent the substrate from being cracked by fixing the dielectric substrate on a base metallic plate while using bolt via an elastic protection plate and a ring.

CONSTITUTION: The dielectric substrate 11 has a mounting hole 11a made of a ceramic and a circuit conductor formed by metallizing and electronic components are mounted on the surface and a ground conductor by metallizing is formed on the entire rear face. Captions 12, 13 are respectively a chassis and an elastic protection plate having a mounting hole 13a, around which a recess 13b is provided to arrange an elastic ring 14. A bolt 14 is inserted to respective mounting holes 13a, 11a of the protection plate 13, the substrate 11 and the ring 14, they are fixed to the chassis 12.


Inventors:
NISHI TAKESHI
TAKAHASHI HIROSHI
Application Number:
JP27711985A
Publication Date:
June 19, 1987
Filing Date:
December 10, 1985
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/52; H01L21/58; H01P1/00; H01P3/08; (IPC1-7): H01L21/58; H01P1/00; H01P3/08
Attorney, Agent or Firm:
Toshio Nakao



 
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