Title:
MICROWAVE INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JP3934417
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a microwave integrated circuit using an interdigital capacitor having a coplanar structure, which reduces the crosstalk with external circuits, decreases the influence on the microwave integrated circuit and external circuits, and increases the charge capacity value of an interdigital capacitor.
SOLUTION: The interdigital capacitor 11 has a coplanar structure used for a microwave integrated circuit 10. A bridge-like ground conductor 14 is bridged above and across coplanar electrodes 12, 13 to reduce the crosstalk and the influence on the microwave integrated circuit 10 and external circuits and to increase the charge capacity value of the capacitor 11.
Inventors:
Hideki Takasu
Application Number:
JP2001397488A
Publication Date:
June 20, 2007
Filing Date:
December 27, 2001
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L21/822; H01L27/04; H01P3/02; (IPC1-7): H01L21/822; H01L27/04; H01P3/02
Domestic Patent References:
| JP3211870A | ||||
| JP4180402A | ||||
| JP6224562A | ||||
| JP2001223504A | ||||
| JP2001274325A |
Attorney, Agent or Firm:
Hisashi Hatano
Shunguchi Sekiguchi
Shunguchi Sekiguchi
Previous Patent: SWIRL FLOW TYPE BURNER
Next Patent: CALCIUM PHOSPHATE HARDENED BODY, CALCIUM PHOSPHATE POROUS BODY AND METHOD OF PRODUCING THE SAME
Next Patent: CALCIUM PHOSPHATE HARDENED BODY, CALCIUM PHOSPHATE POROUS BODY AND METHOD OF PRODUCING THE SAME