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Title:
MIRROR-CHAMFERING DEVICE OF WAFER PERIPHERY
Document Type and Number:
Japanese Patent JPH04346429
Kind Code:
A
Abstract:

PURPOSE: To provide a simple-structured small-sized mirror-chamferring device capable of mirror-chamferring a wafer periphery describing a smooth curve in a sectional arc shape simply by adsorption-holding a single surface of the wafer as well as extending the life of a polishing cloth.

CONSTITUTION: The mirror-chamferring device is composed of a polishing cloth adhering rotary surface plate 1 and an absorption plate 11 movable in the rotary axle L1 direction (Z direction) of the rotary surface plate 1 and in the direction (X direction) perpendicular to the Z axial direction as well as pivotal around the axle perpendicular to the rotary axle L1 further rotatably supported around the axle L3 perpendicular to the axle L1. Finally, when a wafer W periphery held by the vacuum-chuck plate 11 is pressed down on a polishing cloth 2 and the vacuum-cluck plate 11 is continuously pivoted while pouring a slurry, the outer periphery of the wafer W with single surface thereof only fixed to the vacuum plate 11 can be mirror-chamferred in the smooth arc shaped section by the polishing cloth 2.


Inventors:
HASEGAWA FUMIHIKO
YAMADA MASAYUKI
Application Number:
JP14823191A
Publication Date:
December 02, 1992
Filing Date:
May 24, 1991
Export Citation:
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Assignee:
SHINETSU HANDOTAI KK
International Classes:
B24B9/06; B28D5/00; H01L21/304; B24B9/00; (IPC1-7): B24B9/00; B28D5/00; H01L21/304
Domestic Patent References:
JPS52112892A1977-09-21
JPS645759A1989-01-10
Attorney, Agent or Firm:
Koichi Tateno