Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
鏡面仕上げ装置
Document Type and Number:
Japanese Patent JP4153857
Kind Code:
B2
Abstract:

To provide a polishing apparatus, capable of efficiently carrying out a mirror finish processing that needs to be kept from becoming wetted, even while performing cleaning and cooling for maintaining cleanness by removing chips produced during grinding (polishing) processing from the periphery of a work even in polishing processing by a mechano-chemical grinding means and for cooling to prevent frictional heat from accumulating and overheating.

The mirror finishing apparatus is provided with a grinding means, capable of slidably coming into contact with the surface of work 10 to be ground (polished) and a cleaning and cooling means for maintaining clean and cooling a portion of the work 10, that will not slidably come into contact with the grinding means, so that it does not wet the grinding means. As a material of the grinding means, such a mechano-chemical grinding stone 30 made of a porous material is used, that satisfies at least one of the conditions that the volume ratio of included grinding stone particles be 25% or higher, the absorption time based on JIS is 5 seconds or less, the volume ratio of porous is 40% or more, the structure has continuous porous, and the rubber hardness is not less than 10 and not more than 30.

COPYRIGHT: (C)2005,JPO&NCIPI


Inventors:
Tetsuo Okuyama
Shiro Murai
Application Number:
JP2003342071A
Publication Date:
September 24, 2008
Filing Date:
September 30, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Hihei Toyama Co., Ltd.
International Classes:
B08B1/04; B08B3/02; H01L21/304; B24B7/22; B24B55/02
Domestic Patent References:
JP9223680A
Attorney, Agent or Firm:
Isono Dozo