Title:
MIRROR SURFACE POLISHING DEVICE FOR SEMICONDUCTOR SUBSTRATE
Document Type and Number:
Japanese Patent JP2539753
Kind Code:
B
Abstract:
PURPOSE: To improve polishing efficiency and further to attain very high accurate mirror surf ace polishing, in a mirror surface polishing device for a semiconductor substrate for polishing by a mechanochemical polishing method.
CONSTITUTION: By constituting a device such that a plurality of sucker chucks 20 are rotatably mounted on a work surface plate 10 arranged in the downward, to arrange a polishing cloth surface plate 30 arranged in the upward and the work surface plate 10 opposed a little eccentrically from a rotary shaft, polishing can be performed by giving four rotating actions, rotating the work surface plate 10 around an axis, rotating the sucker chuck 20 on its own axis, rotating the polishing cloth surface plate 30 and eccentrically rotating rotary shafts of the upper/lower surface plates 10, 30, to a semiconductor substrate vacuum-sucked to an upper surface of the sucker chuck 20, and a polishing surface of very high quality is obtained while improving polishing efficiency.
Inventors:
Sakai, Masato
Miyaji, Seiji
Miyaji, Seiji
Application Number:
JP1993000259283
Publication Date:
July 08, 1996
Filing Date:
September 21, 1993
Export Citation:
Assignee:
SUMITOMO SITIX CORP
International Classes:
B24B37/04; H01L21/304; (IPC1-7): B24B37/04