Title:
携帯電話のSIMカード取り付け構造
Document Type and Number:
Japanese Patent JP4214350
Kind Code:
B2
Abstract:
A SIM card mounting structure of a mobile phone includes a SIM card receiving recess 5 provided in a rear surface portion of a front side casing of the mobile phone for fittingly receiving a SIM card 1 therein, a pressing portion 3 formed of an elastic material and having one end integrally formed with the rear surface portion of the front side casing and the other end positioned over the SIM card receiving recess to elastically press the SIM card 1 and electrode terminals 2 for connecting electrodes of the SIM card 1 to a battery. The electrode terminals 2 are formed of an elastic material and arranged on a bottom of the recess 5 in an opposing relation to electrodes of the SIM card 1. The one end of the pressing portion is formed integrally on an end portion of the SIM card receiving recess 5 in a longitudinal direction of the mobile phone such that the pressing portion functions as a longitudinal leaf spring. The pressing portion 3 has a notch 4 for setting elasticity of the pressing portion appropriately and facilitating a handling operation of a SIM card.
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Inventors:
Katsuya Sakaguchi
Saito Toyoshi
Saito Toyoshi
Application Number:
JP2001006686A
Publication Date:
January 28, 2009
Filing Date:
January 15, 2001
Export Citation:
Assignee:
NEC
International Classes:
G06K17/00; H04M1/02; G06K7/00; H01R13/64; H04B1/38
Domestic Patent References:
| JP11155004A | ||||
| JP10116323A | ||||
| JP6276263A |
Attorney, Agent or Firm:
Akio Miyazaki
Masaaki Ogata
Ishibashi Masayuki
Masaaki Ogata
Ishibashi Masayuki