Title:
モジュール式電子走査アレイ（ＥＳＡ）
Document Type and Number:
Japanese Patent JP7159484
Kind Code:
B2
Abstract:
A modular communications array includes: an antenna card including a patch antenna array for communicating RF signals; a chip carrier card including a plurality of monolithic microwave integrated circuits (MMICs), each with a power amplifier (PA) and positioned on a respective metal post of a plurality of metal posts, wherein; a phase shifter card including a plurality of phase shifter circuits for beam steering and gain control and a plurality of cavities. Each of the cavities corresponds to a location for the respective metal post on the chip carrier card; and a cooling block coupled to the chip carrier card by a thermally conductive epoxy for cooling, where the phase shifter card is replaceable without affecting the components of the antenna card and the chip carrier card.
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Inventors:
Gamalski, Andrew David
Brown, Andrew, K.
Hinbaza, Darren
Brown, Kenneth, W.
Brown, Andrew, K.
Hinbaza, Darren
Brown, Kenneth, W.
Application Number:
JP2021553847A
Publication Date:
October 24, 2022
Filing Date:
March 27, 2020
Export Citation:
Assignee:
Raytheon Company
International Classes:
H01Q21/06; H01Q3/30; H01Q23/00
Domestic Patent References:
| JP5023164U | ||||
| JP2015511070A |
Foreign References:
| WO2017033525A1 | ||||
| CN103457015B | ||||
| CN104332413A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Osamu Miyazaki
Tadahiko Ito
Osamu Miyazaki