Title:
モジュール化キーボード
Document Type and Number:
Japanese Patent JP5042287
Kind Code:
B2
Abstract:
A modular keyboard includes an upper casing, a lower casing corresponding to the upper casing, an electric conduction element and a circuit board. The upper casing includes a first side and a second side opposite to each other, and a plurality of press keys disposed on the first side. The lower casing is set for sealing the second side, and an enclosure space is formed between the upper casing and the lower casing. The electric conduction element is installed on the second side in the enclosure space, and the circuit board is installed between the electric conduction element and the lower casing. With a supersonic welding technique, the upper casing and the lower casing are engaged with each other to seal the enclosure space and isolate the electric conduction element in the enclosure space and the circuit board from the exterior.
Inventors:
Chapter respect
Xie Aomine
Lee
Xie Aomine
Lee
Application Number:
JP2009194520A
Publication Date:
October 03, 2012
Filing Date:
August 25, 2009
Export Citation:
Assignee:
Asahi Denshi Fun Co., Ltd.
International Classes:
H01H9/04; H01H11/00; H01H13/06; H01H13/70; (IPC1-7): B01D53/22
Domestic Patent References:
| JP51038078A | ||||
| JP60059429U | ||||
| JP2000135740A | ||||
| JP52044382U | ||||
| JP59139918U | ||||
| JP3069540U |
Attorney, Agent or Firm:
Kenzo Hara International Patent Office