Title:
モジュール式取付け装置
Document Type and Number:
Japanese Patent JP2006513547
Kind Code:
A
Abstract:
Disclosed is a wiring device that can be equipped with at least one connection module and is provided with a contacting device(s). In order to protect the optionally live contacting device(s) of the wiring device with simple device(s) against accidental contact when contacting the connection module that can be coupled, an insulating device(s) is disposed at the end of and/or along the contacting device(s).
Inventors:
Flimet, Michael
Royer, Fritz
Royer, Fritz
Application Number:
JP2004567239A
Publication Date:
April 20, 2006
Filing Date:
November 07, 2003
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
H01H9/02; H01H45/14; H01H73/20; H02B1/14; H02B1/20; H01R13/514
Attorney, Agent or Firm:
Iwao Yamaguchi