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Patent Searching and Data


Title:
モジュラー試験装置
Document Type and Number:
Japanese Patent JP2009523206
Kind Code:
A
Abstract:
The modular testing facility (1) has a test module (2) with an adjacent technical module (3) of the same length as the test module and which are surmounted by supply modules (4,5,6) whose combined width corresponds to the width of the first two modules and whose length is smaller. Electrical bus bar and gas exhaust (11) facilities may be interconnected with adjacent modular assemblies.

Inventors:
Peter, Ziegler
Christoph, Schmidt
Application Number:
JP2008549806A
Publication Date:
June 18, 2009
Filing Date:
December 21, 2006
Export Citation:
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Assignee:
Afao El Deutschland Game Behr
International Classes:
E04H5/02; E04H1/12
Domestic Patent References:
JPH09228495A1997-09-02
JP2000204666A2000-07-25
JP2001040772A2001-02-13
JPH08165717A1996-06-25
Foreign References:
DE10361621A12005-07-28
WO2001025745A12001-04-12
Attorney, Agent or Firm:
Kenji Yoshitake
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma
Hideyuki Mori