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Title:
MODULATED MULTI-TAPE LAPPING DEVICE
Document Type and Number:
Japanese Patent JP2007260812
Kind Code:
A
Abstract:

To provide a modulated multi tape lapping device which facilitates addition and elimination of a shoe assembly, a polishing material-coated tape and a tape holder in response to a change of the number of machining positions of the outer surface or the inner surface of a machined material without remodeling the whole of a unit including a dedicated series of several shoe assemblies, the polishing material-coated tape, and the tape holder.

There are integrally assembled as a replaceable arm module 20: a cassette main body 1 fitted to a pair of straight moving slides 11 and 12, which are respectively fixed to a machine main body 10, freely to move in a Z-axis direction toward the machined material; a pair of opening/closing arms 6 and 6, which are arranged around an arm opening/closing shaft fitted to the cassette main body 1, freely to open and close; shoe assemblies 5 and 5 having a pair of relatively rigid recessed surfaces for pushing the polishing material-coated tape by bringing the polishing material-coated tape supported by the pair of opening/closing arms 6 and 6 in contact with a shaft surface 4 of the machined material 2; and an arm opening/closing clamp cylinder 7.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
AKIZUKI HIROSAKU
FUJII HIROSHI
Application Number:
JP2006087119A
Publication Date:
October 11, 2007
Filing Date:
March 28, 2006
Export Citation:
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Assignee:
NACHI FUJIKOSHI CORP
International Classes:
B24B21/00; B24B21/06
Domestic Patent References:
JP2000263410A2000-09-26
JP3558917B22004-08-25
JP2005125424A2005-05-19
JPH11207593A1999-08-03
JPH04343651A1992-11-30
JP2005125423A2005-05-19
JP2000263398A2000-09-26
JPH03221369A1991-09-30
Attorney, Agent or Firm:
Junji Kawachi