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Title:
モジュール連接システム
Document Type and Number:
Japanese Patent JP5419651
Kind Code:
B2
Inventors:
Yoshinori Arai
Application Number:
JP2009270610A
Publication Date:
February 19, 2014
Filing Date:
November 27, 2009
Export Citation:
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Assignee:
Fujikura Ltd.
International Classes:
H03K21/40; G06F1/18
Domestic Patent References:
JP200779731A
JP5108535A
JP3288205A
JP4311123A
JP5307426A
Attorney, Agent or Firm:
Kenji Okada
Katsuhiro Imashita



 
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