Title:
インタフェースモジュール及び挿入可能なモジュラジャックを有するモジュール組立体
Document Type and Number:
Japanese Patent JP5447986
Kind Code:
B2
Abstract:
A module assembly includes an interface module including a housing having a plurality of jack cavities and associated jack latch openings. The housing is configured to be mated with a patch panel. The module assembly also includes a plurality of modular jacks that are directly inserted into corresponding jack cavities. Each modular jack includes a single latch arm that engages the jack latch opening to retain the modular jack in the jack cavity. Optionally, each modular jack may include a top surface and a bottom surface, wherein the latch arm extends from the top surface and wherein the bottom surface is planar. The bottom surface may rest flush with a bottom wall of the jack cavity.
Inventors:
Herndon, Stephen, Scott
Burwell, Robert, Jeffrey
Geniac, Joseph, Edward
Dooley, Christine, Anne
Burwell, Robert, Jeffrey
Geniac, Joseph, Edward
Dooley, Christine, Anne
Application Number:
JP2010519230A
Publication Date:
March 19, 2014
Filing Date:
July 30, 2008
Export Citation:
Assignee:
Tyco Electronics Corporation
International Classes:
H01R24/62; H01R13/74; H01R24/58
Domestic Patent References:
| JP2005050786A | ||||
| JP2004311439A | ||||
| JP2002373742A |
Attorney, Agent or Firm:
Tyco Electronics Corporation