To provide a small/high-density module component incorporating a circuit component, in which an active component and an electric element of it which are heretofore only mounted on a multilayer interconnection board are incorporated.
The small/high-density module component comprises a wiring circuit pattern provided on an insulating resin layer, a connection conductor which electrically connects between the wiring circuit patterns provided in the insulating resin layer, an active component and a passive component electrically connected on the wiring circuit pattern provided on a prescribed insulating resin layer, and a coil part formed at the prescribed section of the laminate. The coil part has a coil pattern of conductor on the prescribed insulating resin layer, while the coil pattern is sandwiched between magnetic members provided on the upper and lower insulating resin layers.
HIGASHIYA HIROSHI
ANPO TAKEO
KATSUMATA MASAAKI
HANDA HIROYUKI
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