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Title:
モジュール結合システム
Document Type and Number:
Japanese Patent JP5037010
Kind Code:
B2
Abstract:
Module components are packaged individually and delivered in a non-integrated state. These separate modules may be assembled readily without the use of specialized tools. A preferred configuration is a solid ink printer base module and a second module mounted to the base module through a quick coupling, quick release mechanism. The coupling mechanism may include a hinge and a self-actuating catch. A module coupling system with complementary parts on each module comprises: a first module having a coupling housing and a catch engagement surface, and a second module having a physical, three-dimensional guide surface, a biased retractable catch, a catch decoupling device, and a catch reset mechanism.

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Inventors:
Aaron Tea. Nelson
Waikiki
Brent Earl Jones
In Macia
Application Number:
JP2005370034A
Publication Date:
September 26, 2012
Filing Date:
December 22, 2005
Export Citation:
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Assignee:
XEROX CORPORATION
International Classes:
F16B1/02; G03G15/00; H05K5/02; B41J29/13; H04N1/00
Domestic Patent References:
JP2002128328A
JP52013083U
JP2001270188A
JP11182509A
JP61112687U
JP50069194U
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori



 
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