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Title:
MODULE FOR MAGNETIC SENSOR
Document Type and Number:
Japanese Patent JP2017181059
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a module for a magnetic sensor that is compact, has high spatial resolution, and has no risk of damaging the magnetic sensor formed on a substrate by impact force and stress at the time of installation of the module for the magnetic sensor in a measuring object and vibration transmitted from the measuring object.SOLUTION: A module 10 for a magnetic sensor includes: a magnetic sensor chip 12 for detecting magnetism formed on a principal surface of a substrate 11; a first magnetic material 13 installed in the vicinity of the magnetic sensor chip; and a second magnetic material 14 disposed in an alienated fashion from the first magnetic material. A notch section 15 is provided on a part of a surface where the first magnetic material faces the second magnetic material of at least one of the first magnetic material and the second magnetic material.SELECTED DRAWING: Figure 1

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Inventors:
TANABE KEI
SHINOHARA HIDENORI
ASAZUMA YUKI
TAKAHASHI SHOJI
Application Number:
JP2016063492A
Publication Date:
October 05, 2017
Filing Date:
March 28, 2016
Export Citation:
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Assignee:
TDK CORP
International Classes:
G01R33/02; G01R33/07; G01R33/09; H01L43/02; H01L43/04
Domestic Patent References:
JPS5571064A1980-05-28
JPH1022545A1998-01-23
JP2000340856A2000-12-08
JP2003149312A2003-05-21
Foreign References:
WO2011111593A12011-09-15



 
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