Title:
MODULE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2022046285
Kind Code:
A
Abstract:
To provide a module capable of connecting a transmission line and a ground line without deteriorating high frequency characteristics even when there is an external size error of a printed circuit substrate, and a manufacturing method thereof.SOLUTION: A module includes a plurality of dielectric substrates 11a and 11b in which a microstrip line is formed on the upper surface and a ground line is provided on any surface from the upper surface to the lower surface, a plurality of shield cases 12a, 12b, 13a, and 13b that sandwich the vertical direction of each of the dielectric substrates for the dielectric substrate, a transmission line substrate 11c that connects microstrip lines formed on the plurality of dielectric substrates, and connecting brackets 14 and 15 that cover the transmission line substrate and connect a plurality of shield cases. At least a part of the end face of the dielectric substrate protrudes from the shield case, and the portion of the end face of the dielectric substrate protruding from the shield case is plated to form a conductor conducting with the ground line.SELECTED DRAWING: Figure 1
Inventors:
KURAMITSU KOTA
Application Number:
JP2020152239A
Publication Date:
March 23, 2022
Filing Date:
September 10, 2020
Export Citation:
Assignee:
ANRITSU CORP
International Classes:
H01P5/02; H01P3/08; H01P11/00; H05K1/14; H05K9/00
Attorney, Agent or Firm:
Kenji Okada
Masaaki Hata
Mari Tanaka
Tetsuji Ueto
Katsuhiro Imashita
Nana Umezawa
Masaaki Hata
Mari Tanaka
Tetsuji Ueto
Katsuhiro Imashita
Nana Umezawa