To achieve a module for optical apparatus which has the structure capable of effectively preventing the damage of its micro-lens in its manufacturing process.
The module 1 for optical apparatus has a solid photographing element 11 provided with an effective pixel region 11a having a micro-lens array 11b, and has a translucent lid 12 having a translucence for covering the effective pixel region 11a. The translucent lid 12 is fastened to the outside region of the effective pixel region 11a in the solid photographing element 11 via a bonding portion 14, and the effective pixel region 11a and the translucent lid 12 are separated from each other. Also, an electrode pad 16 disposed in the outside of the effective pixel region 11a is buried in the bonding portion 14.
WO/1998/024196 | OPSISTOR TRANSMITTER DATA COMPRESSION CIRCUIT |
JPH10224558 | IMAGE SENSOR CHIP AND IMAGE SENSOR |
JP2000164838 | SOLID-STATE IMAGE PICKUP DEVICE AND ITS MANUFACTURE |
KADA MORIHIRO
JP2005056998A | 2005-03-03 | |||
JP2004207461A | 2004-07-22 |