Title:
MODULE STRUCTURE OF IC CARD
Document Type and Number:
Japanese Patent JP3206839
Kind Code:
B2
Abstract:
PURPOSE: To make it easy to manufacture an IC card module of a simple structure having superb impact resistance and light shielding properties.
CONSTITUTION: The finger part 6 of a single layer circuit board 1 with a single face pattern is molded by bending leaving a light-shielding pattern 5, in a device hole 3, and in such a manner that the part 6 comes to almost the equal position to the lower face. Further, the end of the finger part 6 is connected to an IC chip by a bump 7, and both parts are side potted using a holding bracket 8. Further, the IC chip 2 is allowed to protrude from the circuit board 1 and mounted by permitting a resin area 11 to cover an area from the same plane as an electroconductive pattern 4 on the circuit board 1 to the lateral surface of the IC chip including the thickness of the circuit board 1. Consequently, it is possible to protect the IC chip against external impacts and also external light and manufacture the module structure of an IC card having high reliability and productivity at low cost without the necessity of a molding die.
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Inventors:
Toyoji Kanazawa
Akira Nagasaki
Akira Nagasaki
Application Number:
JP31429892A
Publication Date:
September 10, 2001
Filing Date:
October 30, 1992
Export Citation:
Assignee:
Citizen Electronics Co., Ltd.
International Classes:
B42D15/10; G06K19/077; H01L21/56; H01L21/60; H01L23/28; (IPC1-7): G06K19/077; B42D15/10
Domestic Patent References:
| JP2178095A | ||||
| JP6282096A | ||||
| JP1253494A | ||||
| JP63183892A | ||||
| JP6331141A | ||||
| JP63201783U |
Attorney, Agent or Firm:
Hiroaki Gojong