To provide a module with a built-in component capable of improving the reliability of electric connection between a wiring part of a resin substrate and a circuit part and capable of simplifying the manufacturing steps.

The module with a built-in component 10 includes a circuit part 11 having first, second external electrodes 11A, 11B on both ends, a non-photosensitive resin layer 12 with the circuit part 11 embedded therein so as to expose at least part of the first, second external electrodes 11A, 11B of the circuit part 11, a photosensitive resin layer 13 formed on the upper surface of the non-photosensitive resin layer 12, and first, second wiring parts 14, 15 formed through the photosensitive resin layer 13 so as to be electrically connected with the first, second external electrodes 11A, 11B of the circuit part 11.