Title:
弾性波デバイス内蔵モジュール及び通信装置
Document Type and Number:
Japanese Patent JP5358724
Kind Code:
B1
Abstract:
An acoustic wave device built-in module includes: a multilayer wiring board formed by stacking an insulating layer and a wiring layer; an acoustic wave device embedded in the multilayer wiring board; and an electronic component located on the multilayer wiring board and electrically coupled to the acoustic wave device, wherein the acoustic wave device includes: an electrode that is located on a substrate and excites an acoustic wave; and a sealing portion that includes a frame body located on the substrate so as to surround the electrode and a lid located on the frame body so as to form an air space above the electrode, and the lid is recessed toward the substrate.
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Inventors:
Motoyuki Tajima
Application Number:
JP2012145819A
Publication Date:
December 04, 2013
Filing Date:
June 28, 2012
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H03H9/25; H03H9/17; H03H9/70; H03H9/72
Domestic Patent References:
| JP2007312108A | ||||
| JP7045735A | ||||
| JP2012070098A | ||||
| JP2002208650A | ||||
| JP6188326A | ||||
| JP4170811A | ||||
| JP55093238A | ||||
| JP11055062A |
Attorney, Agent or Firm:
Shuhei Katayama