Title:
MODULE
Document Type and Number:
Japanese Patent JP2015077567
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress breakage such as a crack or chipping, and to ensure high sealability, in a module having a flange structure made from dense inorganic brittle material.SOLUTION: In a flange structure 20 made from dense inorganic brittle material, an annular joint portion 21 is equipped with plane surface portions 21a and 21b opposite to each other, and annular projecting portions 21c and 21d having abutting portions 21c1 and 21d1 abutting on a seal member 6. Side walls of annular projecting portion cross sections are extended from the abutting portions 21ac1 in axial directions at angles θ5 and θ6 which are not less than 90 degrees and not more than 155. The abutting portions 21c1 and 21d1 are disposed at at least superimposed positions, and furthermore, the width of the abutting portions 21c1 and 21d1 is formed to be smaller than the cross sectional plane surface width of the seal member 6 receiving a load.
Inventors:
AMANO MASAMI
TAKEDA SOTARO
TAKEDA SOTARO
Application Number:
JP2013216791A
Publication Date:
April 23, 2015
Filing Date:
October 17, 2013
Export Citation:
Assignee:
COVALENT MATERIALS CORP
International Classes:
B01D63/00; B01D29/11; B01D46/00; B01D46/24; B01D63/06; B01D71/02
Domestic Patent References:
| JPH11192419A | 1999-07-21 | |||
| JPH11188218A | 1999-07-13 | |||
| JPH10286418A | 1998-10-27 | |||
| JPS51126382A | 1976-11-04 | |||
| JP2012031967A | 2012-02-16 | |||
| JP2012251852A | 2012-12-20 | |||
| JP2001300228A | 2001-10-30 | |||
| JPS6332627U | 1988-03-02 |
Foreign References:
| WO2009118934A1 | 2009-10-01 |
Attorney, Agent or Firm:
Kinoshita Shigeru