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Title:
センサ搭載のモジュール及び電子部品
Document Type and Number:
Japanese Patent JP4511333
Kind Code:
B2
Abstract:

To provide a module loaded with a sensor having directivity of detection, mountable on a mounting substrate whose position is changed, even if the position determined beforehand of the mounting substrate to be loaded with the module is changed to a position vertical thereto.

In this module 10 whose upper surface shape and under surface shape are rectangular, loaded with the sensor 14 having directivity of detection, a plurality of connection pads connected electrically to each electrode of the sensor 14 are formed on each periphery of upper and lower edges on one end side of the module 10 and upper and lower edges on the other end side parallel to one end side, and each connection pad is formed at a position where the upper surface or the under surface of the module 10 can be mounted flatly on the mounting substrate. The module 10 has a characteristic wherein, when the module 10 is mounted on a mounting substrate vertical to the mounting substrate for flat mounting, one side surface or the other side surface of the module 10 is formed at a position mountable on the side surface of the vertical mounting substrate so that the detection direction of the sensor 14 on the module 10 becomes the same direction as the case where the module 10 is mounted flatly.

COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Hirofumi Takeuchi
Application Number:
JP2004371826A
Publication Date:
July 28, 2010
Filing Date:
December 22, 2004
Export Citation:
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Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
G01P15/08; H01L43/02
Domestic Patent References:
JP2003017612A
JP2003078122A
JP2001227902A
JP2001352001A
JP9148700A
JP11281354A
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu



 
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